Electronic component module
US6914787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2004 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | May 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.