Multi-barrel die transfer apparatus and method for transferring dies therewith
US6915551B2 · kind B2 · utility
1Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Apr 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.