Process of molding and assembling three-dimensional ornaments
US6915554B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2003 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Apr 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4998
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a process of molding and assembling a three-dimensional ornament, a mold having a recess in which is formed an opening is provided. A molding pattern is located inside the opening. A first material fills in the molding pattern to form a plurality of protruded decoration patterns. Then, a second material is charged in the opening and the recess of the mold over the first material to respectively form a projection and a contact wall which together form an embossment. The embossment then is removed from the mold. The embossment then is mounted inside a hollow pen tube in a manner that the projection fits in a sidewall opening of the pen tube and the protruded decoration patterns protrude from the sidewall opening. A sleeve is inserted in the hollow pen tube to urge the contact wall of the embossment against the wall of the hollow pen tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.