System and process for solid-state deposition and consolidation of high velocity powder particles using thermal plastic deformation
US6915964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Feb 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/30
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to an apparatus and process for solid-state deposition and consolidation of powder particles entrained in a subsonic or sonic gas jet onto the surface of an object. Under high velocity impact and thermal plastic deformation, the powder particles adhesively bond to the substrate and cohesively bond together to form consolidated materials with metallurgical bonds. The powder particles and optionally the surface of the object are heated to a temperature that reduces yield strength and permits plastic deformation at low flow stress levels during high velocity impact, but which is not so high as to melt the powder particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.