Modular heat sinks
US6916122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Oct 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6582
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.