Tire mold having improved heat transfer characteristics
US6916164B2 · kind B2 · utility
6Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Jul 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D30/0629
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A tire mold having improved heat transfer is disclosed. A plurality of wear plates are installed onto a conical inner surface of an actuating ring. The wear plates are designed to improve thermal transfer between the actuating ring and a segmented treadmolding ring, reducing tire cure time and temperature variation within the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.