Array socket with a dedicated power/ground conductor bus
US6916183B2 · kind B2 · utility
61Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2003 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Mar 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10704
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.