Polishing machine
US6916234B2 · kind B2 · utility
Inventor
Key dates
| Filing date | May 1, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | May 11, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing machine in which adverse influence caused by a surface condition of a retainer ring can be reduced with a simple structure. The polishing machine includes a rotatable polishing plate; a top ring including a holding plate for holding and pressing a wafer onto a polishing cloth of the polishing plate; an independently rotating retainer ring in which the holding plate is freely inserted; and a positioning member for correctly positioning the retainer ring on the polishing cloth while the retainer ring is rotated. The retainer ring includes a pressing member which presses the polishing cloth along an outer edge of the wafer to make the level of the polishing cloth pressed by the pressing member substantially equal to that of the polishing cloth pressed by the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.