Integrated sensor packages and methods of making the same
US6917089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements. Alternatively, or in addition, an optically transmitting gel is used so as to allow for the passage of radiation at specific wavelengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.