Molded semiconductor power device having heat sinks exposed on one surface
US6917103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Dec 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, a first heat sink, a second heat sink, and a mold resin. The first heat sink is electrically and thermally connected to a surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat generated by the semiconductor chip. The second heat sink is electrically and thermally connected to another surface of the semiconductor chip for functioning as another electrode for the semiconductor chip and releasing the heat. The semiconductor chip and the first and second heat sinks are covered with the mold resin such that the heat sinks are exposed on a substantially flat surface of the mold resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.