MEMS device and method of forming MEMS device
US6917459B2 · kind B2 · utility
18Cited by
8References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Oct 2, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a first side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, forming a protective layer over the dielectric layer, defining an electrical contact area for the MEMS device on the protective layer, and forming an opening within the electrical contact area through the protective layer and the dielectric layer to the at least one conductive layer of the substructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.