Electronic component module
US6917526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2004 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.