Method for fabricating surface mountable chip inductor
US6918173B2 · kind B2 · utility
5Cited by
8References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2001 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a method for fabricating a surface mountable chip inductor, a spiral coil pattern is formed on a surface of a cylindrical body fabricated by mixing ferrite or ceramic powder with thermoplastic organic binder, the cylindrical body is transformed into a square-shaped body by being inserted into a square-shaped mold and pressure being applied at a certain temperature. An electric characteristic lowering problem can be prevented by forming the coil on the cylindrical body, and transforming the cylindrical body into a square-shaped body to improve surface mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.