Method for producing metal/ceramic bonding circuit board
US6918529B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Oct 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock r…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.