Apparatus for mounting chips
US6919007B2 · kind B2 · utility
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11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Apr 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53196
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.