Conductive pattern material and method for forming conductive pattern
US6919158B2 · kind B2 · utility
25Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2002 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Nov 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/464
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.