Polyimide resin with reduced mold deposit
US6919422B2 · kind B2 · utility
35Cited by
30References
54Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.