Semiconductor device and method for fabricating the same
US6919641B2 · kind B2 · utility
42Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Jun 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.