Monolithically integrated microwave guide component for radio frequency overcoupling
US6919773B2 · kind B2 · utility
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2References
8Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 18, 2004 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Aug 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/047
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A monolithically integrated microwave guide component for overcoupling high frequencies includes a first micro-waveguide that is structured on a micro-waveguide chip, and comprises a second micro-waveguide that is structured on a carrier substrate. The microwave guides are contacted to one another by a chip through-plating. The microwave guides each include, in the contact region, an integrated compensating structure that serves to compensate for reflections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.