Automated lapping system
US6921317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2002 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Jan 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25J11/0065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automated lapping system is provided for lapping a work product using a robot. Because the robot can apply continuous consistent pressure that far exceeds the capabilities of a human operator, lapping and polishing evolutions take a fraction of the time taken by a human operator. The system includes a robot having one or more lapping end effectors and a control component that controls the robot to lap the work product. The control component includes a processor, a user interface coupled to the processor, a communication component that receives final work product dimensions, and a positioning component that detects a lapping zone on the work product and sends the detected lapping zone to the control component. The control component controls the robot based on the sent lapping zone and received work product dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.