Etch resist using printer technology
US6921550B2 · kind B2 · utility
0Cited by
14References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Nov 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate into the printer, printing an inverse circuit image on the copper-clad substrate, allowing the inverse circuit image to dry, metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper to form a metalized circuit image, and etching the copper-clad substrate that has been metalized to remove copper that forms the inverse circuit image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.