Thermoplastic resin foam molding
US6921571B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2002 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Jan 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249989
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention intends to provide a thermoplastic resin foam molding comprising a substrate having a foam layer and a projection formed in one piece together with the substrate wherein the projection hardly separates from the substrate and they are firmly jointed together. The invention provides a thermoplastic resin foam molding comprising a substrate and a projection formed in one piece together with the substrate wherein the substrate has a foam layer and a skin layer containing no voids wherein the ratio (R/L) of the curvature R of a joint between the projection and the substrate to the thickness L of the skin layer is from 3 to 50.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.