Semiconductor device and manufacturing method for the same, circuit board, and electronic device
US6921683B2 · kind B2 · utility
29Cited by
4References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 24, 2003 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | May 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set 30 of multiple heat radiation bodies 32 in a mold 40 cavity 42; (b) setting a substrate 10 on which multiple semiconductor chips 20 are mounted in a planar arrangement in the mold 40 so that the multiple semiconductor chips 20 are located inside the cavity 42; and (c) sealing the multiple semiconductor chips 20 and affixing the heat radiation body set 30 by filling the cavity 42 with a sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.