Heat releasing member, package for accommodating semiconductor element and semiconductor device
US6921971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2004 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Jan 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.