Surface acoustic wave filter adapted to restrain undue temperature rise
US6922119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2003 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | May 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.