System and method for monitoring defects in structures
US6922641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2003 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Sep 17, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B7/281
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for monitoring defects in a structure are provided. The system includes a power supply for supplying an electric current to a monitoring area of the structure and a reference; a measurement circuit for measuring a potential drop across at least two contact points of the monitoring area and at least two contact points of the reference; and a processor adapted to determine a ratio of the monitoring area potential drop to the reference potential drop indicative of a percentage change in a thickness of the structure. The method includes the steps of supplying the current to the monitoring area and the reference; measuring a first potential drop across the monitoring area and the reference; and determining the ratio indicative of the percentage change in the thickness of the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.