Liquid level sending unit with flexible sensor board
US6923057B2 · kind B2 · utility
14Cited by
29References
15Claims
0Family size
Inventor
Key dates
| Filing date | Mar 3, 2004 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A flexible liquid level sensor board assembly for application with liquid level sending units is presented. The liquid level sending unit includes a stem, float, and a flexible sensor board assembly. The flexible sensor board assembly is a distinct component of the sending unit and as such is capable of repeated insertion and removal from the stem. The flexible sensor board assembly is therefore ideal for existing/retrofit applications and new installations alike.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.