Metallic nanoparticle cluster ink and method for forming metal pattern using the same
US6923923B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.