Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
US6924016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2003 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Mar 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer; and (c) an aqueous adhesive composition interposed between the holding block and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor wafer, comprising the steps of: (a) providing a holding block; (b) providing a semiconductor wafer; (c) coating either the holding block or one side of the semiconductor wafer with the foregoing aqueous adhesive composition; (d) contacting either one side of the semiconductor wafer to the coated holding block or the coated side of the semiconductor wafer to the holding block, such that the semiconductor wafer adheres to the coated holding block; (e) polishing the other side of the semiconductor wafer; and (f) removing the semiconductor wafer from the coated holding block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.