Phase change thermal interface materials including exfoliated clay
US6924027B2 · kind B2 · utility
16Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material is a nanocomposite phase change thermal interface material that includes one or more matrix polymers, one or more thermally conductive fillers, and one or more clay materials. An electronic device includes at least two surfaces joined using the nanocomposite phase change thermal interface material that includes one or more matrix polymers, one or more thermally conductive fillers, and one or more clay materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.