Etch-stop resins

US6924346B2 · kind B2 · utility

Assignee

• Dow Corning Corporation · US

Inventors

• Ronald Boisvert · Midland, US
• Stelian Grigoras · Midland, US
• David Ha · Midland, US
• Brian Harkness · Midland, US
• Craig Rollin Yeakle · Midland, US

Key dates

• Filing date: Oct 4, 2002
• Grant date: Aug 2, 2005
• Expiry date: Oct 21, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24917
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.