High dielectric constant composite material and multilayer wiring board using the same
US6924971B2 · kind B2 · utility
9Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2002 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Sep 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.