Method and apparatus for on-wafer testing of an individual optical chip
US6925238B2 · kind B2 · utility
7Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2002 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Dec 16, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.