System and method for providing cooling systems with heat exchangers
US6926070B2 · kind B2 · utility
12Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Jul 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.