Method of manufacturing spacer, method of manufacturing image forming apparatus using spacer, and apparatus for manufacturing spacer
US6926571B2 · kind B2 · utility
5Cited by
24References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Jul 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/8655
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a spacer having a low-resistance film without using any exhaust device, and being interposed between a first substrate having an image forming member and a second substrate having an electron-emitting device. The method including the steps of preparing a spacer substrate with an edge including a tapered, chamfered or arcuated portion, preparing a liquid comprising a dispersed conductive material or dissolved conductive material, dipping the edge into the liquid, and drying and/or baking the spacer substrate after the dipping step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.