Laser machining method and apparatus
US6926801B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Nov 24, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/72
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser machining method for removing remaining defects on a photomask, there has been problems to be resolved that damage is formed at the portion of the substrate where the defect has been removed, thus resulting in degraded quality of machining. In a laser machining method for removing remaining defects on a photomask by a method of laser machining, the remaining defects are removed by using a configuration in which irradiation with a laser beam is performed from below with a to-be-machined surface directed downward, and irradiation with a laser beam in an atmosphere containing a halogenated hydrocarbon gas (as an example, ethyl iodide).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.