High solids dispersion for wide temperature, pressure sensitive adhesive applications
US6927267B1 · kind B1 · utility
23Cited by
43References
56Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Aug 27, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/302
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure-sensitive adhesive polymer comprising a reaction product of a C1 to C20 alkyl (meth)acrylate, an ethylenically unsaturated carboxylic acid, a C2 to C8 hydroxyalkyl (meth)acrylate, a vinyl aromatic, optionally a ethylenically unsaturated monomer containing sulfonic acid, and optionally a vinyl ester of a carboxylic acid. The pressure-sensitive adhesive polymer can provide adhesion and cohesion in a temperature range from −30° C. to 50° C. for the All-temperature pressure-sensitive adhesive market.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.