Method for seed layer removal for magnetic heads
US6927940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Aug 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4906
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The electroplated components of a magnetic head of the present invention are fabricated utilizing a seed layer that is susceptible to reactive ion etch removal techniques. A preferred seed layer is comprised of tungsten or titanium. Following the electroplating of the components utilizing a fluorine species reactive ion etch process the seed layer is removed, and significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product. The problem of seed layer redeposition along the sides of the electroplated components is overcome because the gaseous fluoride compound is not redeposited. The present invention also includes an enhanced two part seed layer, where the lower part is tungsten, titanium or tantalum and the upper part is composed of the material that constitutes the component to be electroplated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.