Method for fabricating surface acoustic wave filter package
US6928719B2 · kind B2 · utility
25Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Sep 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.