Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
US6928725B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2003 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.