Module apparatus and method of alignment
US6929407B2 · kind B2 · utility
1Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2003 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Jun 8, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3897
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The assembly of a packaged opto-electronic module of a type that comprises an optical subassembly coupled to an LC housing integrally formed within the housing of the module typically results in the optical subassembly being disposed in a location having a gap between a heat sink region of the module and the optical subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.