Sheet material especially useful for circuit boards
US6929848B2 · kind B2 · utility
13Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Aug 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.