MEMS having a three-wafer structure
US6930368B2 · kind B2 · utility
20Cited by
16References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2003 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Jul 31, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/082
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.