Wire bonding method and apparatus for integrated circuit
US6930381B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | Aug 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Wire bonding methods and apparatuses are described herein. In one aspect of the invention, an exemplary apparatus includes a plurality of electrically conductive contacts disposed on a surface of the IC device, the plurality of electrically conductive contacts being disposed in at least two rows, a plurality of first return paths formed through some of the plurality of electrically conductive contacts, a plurality of signal paths formed through some of the plurality of electrically conductive contacts, and wherein at least one of the plurality of first return paths are placed between every predetermined number of the plurality of the signal paths. Other methods and apparatuses are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.