Method for making a heat exchanger with soldered plates and resulting heat exchanger
US6932264B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 26, 2001 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing a plate heat exchanger with multiple plates made of a solderable material. The plated define circuits for fluid circulation and are assembled together by soldering. The soldering is done after a soldering material is applied to the regions to be soldered. The soldering material is deposited on the plates with an electrolytic solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.