Fragmented backplane system for I/O applications
US6932617B2 · kind B2 · utility
16Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2004 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Oct 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1444
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A backplane system allowing a very large number of interconnections between high-connectivity printed circuit boards and a backplane is disclosed. The backplane is fragmented into a plurality of backplane parts that comprise connectors on their edges to mate connectors arranged on the high-connectivity printed circuit boards. These backplane parts may also include other connectors on their edges to couple to extension printed circuit boards requiring less interconnections or cables. Interposers can be used to link several backplane parts and provide enhanced air circulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.