Active wafer for improved gigabit signal recovery, in a serial point-to-point architecture
US6932649B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Mar 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/727
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connector is provided for operation in a point-to-point application. The connector includes an insulated housing having first and second card interfaces configured to mate with associated first and second circuit cards. An electrical wafer is held in the housing and configured to operate in a point-to-point architecture. The signal traces end at signal contact pads located proximate to first and second edges, respectively. The signal contact pads receive a unidirectional signal. Each of the signal traces include a break section at an intermediate point along a length thereof to form a disconnect in the signal traces. The connector further includes an active compensation component bridging the break section in the signal traces. The active compensation component compensates the differential signal incoming from the input contact pads for signal degradation and transmits a compensated signal outward to the output contact pads. The active compensation component transmits the signal only in a single direction within the point-to-point architecture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.