Method and system for flip chip packaging
US6933173B2 · kind B2 · utility
16Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 30, 2003 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Nov 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the invention, a method of packaging flip chips includes providing a plurality of flip chips and a panel, forming a plurality of partitions outwardly from the panel, coupling the flip chips to the panel such that each partition surrounds a respective flip chip, and forming an underfill region between each of the flip chips and the panel. Each partition prevents a respective underfill region from engaging an adjacent underfill region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.