High-frequency signal transmitting device
US6933450B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Jan 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Signal wiring conductors are provided at opposing positions on the upper surface of the uppermost dielectric layer and on the lower surface of the bottommost dielectric layer, and grounding conductors surrounding grounding-conductor non-forming areas are provided on the upper surfaces of intermediate dielectric layers and the bottommost dielectric layer. These grounding conductors form an electromagnetically shielded space by being connected by grounding-conductor via conductors vertically penetrating the respective dielectric layers around the grounding-conductor non-forming areas, and signal via conductors are so provided in the respective dielectric layers as to penetrate this electromagnetically shielded space. A signal via conductor of the uppermost dielectric layer is connected with the signal wiring conductor on the upper surface thereof via a signal-wiring connecting conductor, and a signal via conductor of the bottommost dielectric layer is connected with the signal wiring conductor on the lower surface thereof via a signal-wiring connecting conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.