Semiconductor connection substrate
US6933601B2 · kind B2 · utility
17Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2002 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Jul 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09763
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.